WVTS
Wafer Form AOI / TEST Analyzing System設備架構 (SYSTEM CONFIGURATION)
| 1 | Input – 料匣放置模組 A (magazine) | 12 | CCD – 3D5S (選配) |
| 2 | Wafer Ring (Foil) 夾爪模組 | 13 | Output – 打帶站 A |
| 3 | Loading – XY Table A | 14 | 轉塔模組 B (Turret) 16 分割 |
| 4 | CCD – 取料定位 | 15 | CCD – 放料定位 |
| 5 | 轉塔模組 A (Turret) 16 分割 | 16 | Unloading – XY Table B |
| 6 | 定位站 | 17 | 噴墨印字 |
| 7 | CCD – 背檢 (選配) | 18 | 料匣放置模組 – 空 Wafer Ring (Foil) |
| 8 | B 盤 (測試) 6 分割 | 19 | 料匣放置模組 B (暫存區) |
| 9 | 電測站 | 20 | Wafer Ring (Foil) 夾爪模組 |
| 10 | 積分球 | 21 | Output – 打帶站 B |
| 11 | 定位站 |
| WVAS 810 | WVAS 8100 | WVAS 8101 | WVAS 8200 | WVAS 8300 | WVTS 1000 | WVTS 2000 | ||
| UPH | 45K | 20K | 30K | 20K | 15K | 15K | 15K | |
| Input | Wafer | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ |
| De-Reel | (✔) | (✔) | (✔) | |||||
| Output | Wafer | ✔ | ✔ | ✔ | ||||
| Tray | ✔ | |||||||
| Container | ✔ | |||||||
| Reel | ✔ | ✔ | ✔ | |||||
| Place Accuracy | ± 30 um | ± 30 um | ± 30 um | |||||
| Rotation | ± 2° | ± 2° | ± 2° | |||||
| Vision AOI | Top | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ |
| Bottom | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | ||
| Side | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | ||
| In-Tape | ✔ | ✔ | ✔ | |||||
| Test | (✔) | (✔) | ✔ | ✔ | ||||
| Flip | (✔) | (✔) | (✔) | (✔) | ||||
| Wafer Size | 6"/8"/12" | 6"/8"/12" | 6"/8"/12" | 6"/8"/12" | 6"/8"/12" | 6"/8"/12" | 6"/8"/12" | |
| Package Size | Minimum | 0.4 x 0.2 | 0.4 x 0.2 | 0.4 x 0.2 | 0.4 x 0.2 | 0.4 x 0.2 | 0.4 x 0.2 | 0.4 x 0.2 |
| Maximum | 12 x 12 | 12 x 12 | 12 x 12 | 12 x 12 | 12 x 12 | 12 x 12 | 12 x 12 | |